TAIPEI, (TaiwanToday) – The Ministry of Economic Affairs (MOEA) broke ground on an advanced semiconductor research and development base at the Industrial Technology Research Institute February 10 in Hsinchu County, underscoring the government’s commitment to strengthening Taiwan’s key position in the global semiconductor industry.
In cooperation with the National Development Council and the National Science and Technology Council and with support from the Taiwan Chip-based Industrial Innovation Program, the NT$3.77 billion (US$119.8 million) base is scheduled for completion by December 2027, with phased operations beginning in the first quarter of 2028.
The base is set to house pilot production lines for 12-inch advanced semiconductor processes, 8-inch submicron sensing chips and 3D integrated circuit advanced packaging, as well as a laboratory for inspection, measurement and verification. Once in operation, it will offer services including innovation trial production and verification for IC design, development of advanced semiconductor manufacturing processes, and localized verification of semiconductor equipment and materials.
According to the MOEA, the base will provide research, development and trial production services for 28- to 90-nanometer back-end processes and integrate chip design, manufacturing, packaging and testing into a one-stop service, which is expected to shorten product development time by around 30 percent. It would also support the deployment of cutting-edge technologies including silicon photonics, quantum computing and next-generation memory chips, while facilitating personnel cultivation to forge a comprehensive semiconductor research and development ecosystem for the next generation, the ministry said.
Premier Cho Jung-tai said at the ceremony that the base would enhance the country’s semiconductor technologies, advance relevant equipment and material upgrades and lower validation barriers for small- and medium-sized IC design companies and startups, expediting product release. He noted that the government allocated NT$15.5 billion to semiconductors this year and thanked Taiwan Semiconductor Manufacturing Co. for donating three pieces of 12-inch advanced-process equipment and providing guidance on plant design and construction.
Minister of economic affairs Kung Ming-hsin said that the base will primarily serve small- and medium-sized firms and startups, as well as providing testing services for equipment and material suppliers. He added that he hopes all sectors will work together to continue strengthening the independence and resilience of Taiwan’s semiconductor supply chain.
