-
- TSMC chair says AI-related PMICs, sensors among most in-demand mature-node products
TAIPEI, (Taiwan News) — The rapid growth of AI infrastructure is creating new opportunities for Taiwan suppliers of mature-node semiconductor chips used in power management for advanced computing systems.
TSMC chair C.C. Wei (魏哲家) said at the company’s second-quarter earnings conference that demand for mature-node semiconductor technologies, generally referring to process technologies at 28 nanometers and above, remains healthy overall. Within this segment, he highlighted strong demand for AI-related products, particularly power management integrated circuits and sensors, according to CTEE and Gugu Fund.
Institutional investors said the expansion of AI data centers has become a key growth driver for mature-node chips. As cloud service providers upgrade power infrastructure to support increasingly power-hungry AI servers, they are accelerating adoption of more advanced solutions, including 48-volt power systems, high-voltage direct current systems, and liquid cooling technologies.
This shift is creating demand for chips that improve power conversion, efficiency, and system stability, creating opportunities for Taiwan’s power management chip suppliers. Silergy Corp., is among those expanding into high-performance computing, industrial, and automotive markets.
The company has seen stronger growth from AI-related applications, with data center revenue rising 90 percent from a year earlier in the first quarter and accounting for 15 percent of total revenue, up from a single-digit share in 2025. Growth was mainly driven by PMICs used in server motherboards and related applications such as optical modules, according to Anue.
Silergy has also developed more high-current and high-efficiency power management products, which could help improve its product mix as AI server demand grows.
Anpec Electronics Corp. develops power management, fan control, and other power-related chips. The company has been expanding into AI servers, with current revenue mainly coming from power management applications, according to UDN.
It is currently testing fan control chips for liquid cooling systems with customers. Anpec expects clearer progress by the end of this year, with the products potentially beginning to contribute to revenue next year.
Global Mixed-mode Technology Inc. has also increased its focus on server and high-performance computing applications. Its products include multiphase power controllers and power conversion chips, which help improve voltage stability and power efficiency in advanced computing systems.
Chair Wu Chin-chuan (吳錦川) said in June that the company would gradually raise prices for its products after a three-year pause in price adjustments. Wu said mature-node capacity is tight, with the supply gap continuing to widen and shortages expected to persist through 2027.
Meanwhile, Taiwan’s Asia Electronic Material Co., reported revenue growth in the first half of the year as it diversified beyond printed circuit board materials into higher-value materials for semiconductor and high-frequency applications.
The company posted consolidated revenue of NT$151 million (US$4.68 million) in June, up 44.18 percent from a year earlier. Revenue for the first six months reached NT$749 million, an annual increase of 8.92 percent, supported by a recovery in orders and shipments, according to LTN and CMoney.
Asia Electronic Material specialises in materials used in flexible printed circuit boards, including flexible copper-clad laminates and stiffeners. Unlike traditional rigid circuit boards, FPCs use flexible materials such as polyimide, allowing them to bend and fit into compact electronic devices such as foldable smartphones and camera modules, according to Stockfeel.
In recent years, the company has expanded into advanced materials for semiconductor packaging, AI servers, and high-frequency communications. It has developed new products to support the semiconductor industry’s shift toward thinner packaging designs and more demanding manufacturing processes.
One of the company’s new products is an anti-warp balancing film, which helps reduce warpage during semiconductor packaging. Differences in how materials expand and contract under high temperatures can cause substrate warpage, potentially affecting later manufacturing processes.
The company has also developed high-performance polytetrafluoroethylene materials, also known as PTFE or Teflon. PTFE materials offer low signal loss and strong thermal and chemical stability, making them suitable for high-frequency and high-speed circuit boards used in telecommunications and advanced electronics, according to IPCB.
Asia Electronic Material said both products are undergoing validation with upstream and downstream supply chain partners. If they complete customer certification and enter mass production, the new materials could become a source of future revenue and profit growth.
- Charlotte Lee, Taiwan News, Staff Writer.